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High Speed Brushless Small Linear Servo Motor Precision Motion Stages For Semiconductor Equipment
| Place of Origin | China,Suzhou |
|---|---|
| Brand Name | SUPT MOTION |
| Certification | ISO9001 |
| Model Number | MLCE-0075-075-00 |
| Minimum Order Quantity | 1PCS |
| Price | $200 |
| Packaging Details | Customized packaging etc. |
| Delivery Time | 1-5pcs ,5 days . >20pcs ,To be negotiated |
| Payment Terms | T/T |
| Supply Ability | To be negotiated |
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xProduct Details
| Warranty | 3months-1year | Commutation | Brushless |
|---|---|---|---|
| Peak Force | 215N | Model Number | MLCE-0075-075-00 |
| Efficiency | IE1 | Peak Current(Amps) | 3.1 |
| Weight | 0.45kg | Protect Feature | Totally Enclosed |
| Application | Automatic Product | Type | SERVO MOTOR |
| Speed | High Speed | ||
| Highlight | High Speed small linear servo motor,Brushless small linear servo motor,Semiconductor Equipment small linear servo motor |
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Product Description
Product Description:
Linear motor are untilized in wide variety of products,Markets serviced by SUPT MOTION include:Semiconductor manufacturing equipment, including wafer fabrication and chip packaging equipment ;Flat panel display industry precision test equipment, hard disk manufacturing, manufacturing,printing plate making equipment; Life science, medical equipment, machine vision inspection equipment, a variety of fetching device; Electronic element surface mount, PCB testing equipment, logistics equipment etc.
Linear motors are used in the field of semiconductor equipment:
Dispenser: Accurately control the position and amount of glue dispensing to ensure the accurate application of glue in the semiconductor packaging process and improve the quality and reliability of the package.
Lead wire bonding machine: in the chip packaging process, to achieve accurate bonding of the lead wires, to ensure the quality of the connection between the chip and the external circuit, to improve the performance and reliability of semiconductor devices is essential.
PCB Drilling Machine: Controls the precise position and feed speed of the drill bit to ensure the precision and quality of drilling to meet the manufacturing requirements of high-density PCB boards.
Wafer pick and place: In the process of wafer manufacturing and processing, it is responsible for the precise pick and place operation of wafers, avoiding damage to wafers and guaranteeing the quality and production efficiency of wafers.
Features:
There is only coil and no magnet in the stator, no suction between stator and stator, no cogging effect, smooth running.
The light weight of power can realize high speed and high acceleration.
Smooth thrust characteristics, with the application of scale, to achieve high precision.
Stroke can be extended arbitrarily, silent, maintenance-free.
Product Parameters:
| Linear motor performance parameters | ||||
| E Series--MLCE(Dynamic) MLFE(Stator) | ||||
| Model/Par | MLCE-0075-075-00 | MLCE-0135-135-00 | MLCE-0260-255-00 | |
| Peak force(Fp) | N | 215 | 405 | 780 |
| Peak current(lp) | Amps | 4.8 | 4.35 | 8.1 |
| Continuous force(Fc) | N | 75 | 135 | 260 |
| Continuous current(lc) | Amps | 1.6 | 1.45 | 2.7 |
| Actuator constants(DC motor conversion/3p)(Ka) | N/√W | 12.6 | 17.9 | 25.5 |
| Constant Thrust(L-L)(Kf) | N/Amps | 47.3 | 95.1 | 97.5 |
| Back EMF constant(L-L)(Kb) | V/m/sec | 27.3 | 54.9 | 54.9 |
| Electrical constant(Te) | ms | 0.35 | 0.35 | 0.35 |
| Resistance(L-L)(R) | @25℃ Ω | 9.2 | 18.4 | 9.2 |
| Inductance(L-L)(l) | mh | 3.1 | 6.2 | 3.1 |
| Heat transfer coefficient(Rth) | ℃/W | **2 | **1.35 | **0.72 |
| Coil maximum temperature(Tmax) | ℃ | 120 | 120 | 120 |
| Magnet Pole pitch(2T) | mm | 30 | 30 | 30 |
| Mover weight | Kg | 0.45 | 0.82 | 1.53 |
Application:
| The main application of the linear motor: |
| 1.semiconductor manufacturing equipment,including wafer fabrication and chip packaging equipment,etc. |
| 2.The flat panel display(FPD)industry,precision test equipment/hard disk manufacturing/ |
| connector manufacturing/printing plate-making equipment,etc. |
| 3.Life sciences,medical devices,machine vision inspection equipment,all kinds of devices to take place. |
| 4.Electronic components SMT,PCB testing equipment. |
| 5.Logistics equipment devices. |
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